Penryn Premiere

Penryn Die MarkYesterday marked the dawn of a new era of scaling for CMOS devices. I hope that statement fits with all the hype around the launch of the 45nm microprocessor from Intel. In fairness, though, switching to metal gates and high-k dielectrics represents an important milestone in semiconductor technology. Gordon Moore’s well-worn comments are appropriate:

“The implementation of high-k and metal materials marks the biggest change in transistor technology since the introduction of polysilicon gate MOS transistors in the late 1960s.”

Intel released TEM images of its 45nm PMOS transistor. The embedded SiGe source / drains are evident, but we’ve all seen those before. For his keynote, Paul Otellini seemed confident that we could not tell what Intel’s secret sauce in the dielectric and workfunction metals was, but they had something to hide on top of the gate stack. We can’t see the CMP surface, but that’s a no-brainer for a replacement gate (aka gate last) technique. I think they want to keep the 45nm Structure from Otellini Keynotecapping material on top of the gate electrode hidden until they present at IEDM (Paper 10.2). At about 9:30 on the morning of December 11 in Washington, DC, Kaizad Mistry will open the trench coat on the 45nm HKMG process. Considering the secrecy Intel has been able to maintain on this process, I think the trench coat is a fair reference. Intel deserves full marks for keeping its employees and vendors quiet for so long. Steve Jobs is jealous, I’m sure.

Or maybe he’s not. SI will be opening the kimono on the Penryn this Friday to all our clients participating in the analysis. Intel will still generate lots of excitement at IEDM (at least if you aren’t analyzing 45nm or buying one of our reports).

Intel 45nm Process

There’s been much hype and there will be much more.  The Penryn MPU hit Time magazine’s list of best inventions of 2007 along with the iPhone cover girl. Intel may covet the iPhone socket and may well win it for next generation devices, but there may could be another connection to Time’s list. NASA’s methane powered rocket might one day look to the Intel marketing machine as a steady source of fuel.

3 Comments »

  1. PS said,

    November 15, 2007 at 5:34 pm

    How about this TEM cross section?

    http://download.intel.com/pressroom/kits/45nm/Intel45nm_trans_txt.tif

  2. PS said,

    November 17, 2007 at 3:39 pm

    Interesting, my previous comment disappeared.

    So it does not suit your business that I pointed out that intel had published a full TEM cross section of their 45nm PMOS device? I understand that, but if you chose to have a blog as a medium to communicate with potential customers that is something you should be able to live with.

  3. PS said,

    November 17, 2007 at 3:48 pm

    Excuse me, for some reason me first comment only reappeared after I posted the second one.

    Let me take a guess at the elements that will be revealed during EELS analysis of the metal gate stack:

    Ti,N,C,Si,Ta/Mo (mutually exclusive),O,Cl

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