Backside Follow-up
Last week, I posted a long, wordy (your own description might not be so flattering) article about OmniVision’s OmniBSI announcement. To sum up, OmniVision appears to be first out of the gate with a backside illuminated CMOS image sensor for the mass market. Despite the length of last week’s post, I left out an important detail that every other blog or news source - regardless of credibility - mentioned. As OmniVision’s foundry partner, TSMC is obviously a key player in bringing this new technology to production.
I apologize for omitting TSMC from the discussion. Although I don’t have any details on the working relationship or particulars of the processing TSMC might be applying to the OmniBSI products, the fab is certainly a central component in this process.
Image sensor guru Eric Fossum posted some insightful comments in the dpreview forum. (For more image sensor news go to Image Sensors World where I was pointed to this particular forum post.)In Eric’s words, “consider this announcement REAL and NEAR FUTURE.” That is an even stronger endorsement of his other description of “a major achivement by TSMC.”
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