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	<title>SemiSerious &#187; Industry News</title>
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	<link>http://www.semiconductorblog.com</link>
	<description>Revealing commentary and news about the semiconductor industry.</description>
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		<title>Micron/Nanya debut 42nm SDRAM</title>
		<link>http://www.semiconductorblog.com/2010/02/08/micronnanya-debut-42nm-sdram/</link>
		<comments>http://www.semiconductorblog.com/2010/02/08/micronnanya-debut-42nm-sdram/#comments</comments>
		<pubDate>Mon, 08 Feb 2010 15:57:02 +0000</pubDate>
		<dc:creator>Andrew Woodard</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Memory]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=472</guid>
		<description><![CDATA[Seems like it was just last week (actually, 7 days ago to the hour) that Micron was unveiling its newest, smallest NAND flash process to date. This week, they’re at it again:  Jointly developed with Nanya, the 42nm 2Gb DDR3 SDRAM, with a 49.2mm2 footprint, packs 41.6 Mb into each square millimeter. Having just had [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2010/02/08/micronnanya-debut-42nm-sdram/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>NAND flash frontier reaches 25nm thanks to Intel, Micron</title>
		<link>http://www.semiconductorblog.com/2010/02/01/nand-flash-frontier-reaches-25nm-thanks-to-intel-micron/</link>
		<comments>http://www.semiconductorblog.com/2010/02/01/nand-flash-frontier-reaches-25nm-thanks-to-intel-micron/#comments</comments>
		<pubDate>Mon, 01 Feb 2010 16:00:52 +0000</pubDate>
		<dc:creator>Andrew Woodard</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Memory]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=467</guid>
		<description><![CDATA[IMFT, the flash memory joint venture between Intel and Micron, announce today that they are sampling 25nm 2-bit-per-cell NAND flash devices in densities up to 64Gb (167mm2).  In doing so they become the current “kings of the mountain” with bragging rights on bits per mm2 (392Mb/mm2) and finest line pitch in a launched product.  They [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2010/02/01/nand-flash-frontier-reaches-25nm-thanks-to-intel-micron/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>Intel&#8217;s tweak to plug the leak</title>
		<link>http://www.semiconductorblog.com/2010/01/15/intels-tweak-to-plug-the-leak/</link>
		<comments>http://www.semiconductorblog.com/2010/01/15/intels-tweak-to-plug-the-leak/#comments</comments>
		<pubDate>Fri, 15 Jan 2010 13:00:34 +0000</pubDate>
		<dc:creator>Andrew Woodard</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>
		<category><![CDATA[32nm]]></category>
		<category><![CDATA[45nm]]></category>
		<category><![CDATA[High-K]]></category>
		<category><![CDATA[HKMG]]></category>
		<category><![CDATA[intel]]></category>
		<category><![CDATA[leakage]]></category>
		<category><![CDATA[Penryn]]></category>
		<category><![CDATA[power dissipation]]></category>
		<category><![CDATA[Westmere]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=442</guid>
		<description><![CDATA[Intel's second generation high-K gate dielectric further reduces gate-substrate tunnel current.]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2010/01/15/intels-tweak-to-plug-the-leak/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>TSMC 40nm Yield Issues</title>
		<link>http://www.semiconductorblog.com/2009/07/06/tsmc-40nm-yield-issues/</link>
		<comments>http://www.semiconductorblog.com/2009/07/06/tsmc-40nm-yield-issues/#comments</comments>
		<pubDate>Tue, 07 Jul 2009 02:41:41 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[40 nm]]></category>
		<category><![CDATA[AMD]]></category>
		<category><![CDATA[ELK]]></category>
		<category><![CDATA[GlobalFoundries]]></category>
		<category><![CDATA[Nvidia]]></category>
		<category><![CDATA[tsmc]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=397</guid>
		<description><![CDATA[
div.rdKOAvUBRZ {height: 0pt;width: 3pt;position: absolute;overflow: auto}


]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/07/06/tsmc-40nm-yield-issues/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Predicting the Recovery</title>
		<link>http://www.semiconductorblog.com/2009/06/18/predicting-the-recovery/</link>
		<comments>http://www.semiconductorblog.com/2009/06/18/predicting-the-recovery/#comments</comments>
		<pubDate>Thu, 18 Jun 2009 20:14:52 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Cowan]]></category>
		<category><![CDATA[Global Semiconductor Forecast]]></category>
		<category><![CDATA[Semiconductor Recovery]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=342</guid>
		<description><![CDATA[Brief note from the editor:
People often compliment me on my workload sharing techniques. For those who know me well, it will therefore come as no surprise that today&#8217;s article is written by a guest blogger.
Mike Cowan is a 45-year semiconductor industry veteran who worked for 36 years at IBM&#8217;s Microelectronics Division in East Fishkill, N.Y. [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/06/18/predicting-the-recovery/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>MISFETs at VLSLI 2009</title>
		<link>http://www.semiconductorblog.com/2009/06/14/misfets-at-vlsli-2009/</link>
		<comments>http://www.semiconductorblog.com/2009/06/14/misfets-at-vlsli-2009/#comments</comments>
		<pubDate>Mon, 15 Jun 2009 03:22:20 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Game consoles]]></category>
		<category><![CDATA[ITRS]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Memory]]></category>
		<category><![CDATA[Process]]></category>
		<category><![CDATA[16nm]]></category>
		<category><![CDATA[Ge MISFET]]></category>
		<category><![CDATA[High-K]]></category>
		<category><![CDATA[HKMG]]></category>
		<category><![CDATA[intel]]></category>
		<category><![CDATA[Toshiba]]></category>
		<category><![CDATA[VLSI Symposium]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=331</guid>
		<description><![CDATA[

I mentioned elsewhere that Intel&#8217;s approach of removing the oxide interlayer prior to high-K dielectric deposition was a significant advance on the road to scaling HKMG processes for the 16nm node.  This  joint effort with Sematech and UT Dallas will be presented at VLSI Technology Symposium 2009. Intel&#8217;s oxide-less gate stack technique might be signaling [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/06/14/misfets-at-vlsli-2009/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>GM Bankrupt</title>
		<link>http://www.semiconductorblog.com/2009/06/05/gm-bankrupt/</link>
		<comments>http://www.semiconductorblog.com/2009/06/05/gm-bankrupt/#comments</comments>
		<pubDate>Fri, 05 Jun 2009 18:35:05 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Bailout]]></category>
		<category><![CDATA[Bankruptcy]]></category>
		<category><![CDATA[BlackBerry]]></category>
		<category><![CDATA[GM]]></category>
		<category><![CDATA[ibm]]></category>
		<category><![CDATA[intel]]></category>
		<category><![CDATA[International Trade Commission]]></category>
		<category><![CDATA[ITC]]></category>
		<category><![CDATA[Obama]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=324</guid>
		<description><![CDATA[
div.HszOuCIGpk {height: 0pt;width: 0pt;position: absolute;overflow: auto}


]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/06/05/gm-bankrupt/feed/</wfw:commentRss>
		<slash:comments>2</slash:comments>
		</item>
		<item>
		<title>VLSI 2009 &#8211; the actual preview post</title>
		<link>http://www.semiconductorblog.com/2009/05/27/vlsi-2009-the-actual-preview-post/</link>
		<comments>http://www.semiconductorblog.com/2009/05/27/vlsi-2009-the-actual-preview-post/#comments</comments>
		<pubDate>Thu, 28 May 2009 03:39:31 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[AMD]]></category>
		<category><![CDATA[climate change]]></category>
		<category><![CDATA[collaboration]]></category>
		<category><![CDATA[Common Platform]]></category>
		<category><![CDATA[consortia]]></category>
		<category><![CDATA[global warming]]></category>
		<category><![CDATA[ibm]]></category>
		<category><![CDATA[intel]]></category>
		<category><![CDATA[RCAT]]></category>
		<category><![CDATA[S-RCAT]]></category>
		<category><![CDATA[Samsung]]></category>
		<category><![CDATA[TCAT]]></category>
		<category><![CDATA[VLSI Symposium]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=298</guid>
		<description><![CDATA[Last week I attempted to preview the upcoming VLSI Symposia. The conferences are in Japan this year, and my attention was quickly diverted to the current situation in the Japanese semiconductor industry. With all that off my chest, I am free this week to actually look at some of the papers that will be presented [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/05/27/vlsi-2009-the-actual-preview-post/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>VLSI Japan</title>
		<link>http://www.semiconductorblog.com/2009/05/20/vlsi-japan/</link>
		<comments>http://www.semiconductorblog.com/2009/05/20/vlsi-japan/#comments</comments>
		<pubDate>Thu, 21 May 2009 03:30:14 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[downturn]]></category>
		<category><![CDATA[Elpida]]></category>
		<category><![CDATA[Fujitsu]]></category>
		<category><![CDATA[japan]]></category>
		<category><![CDATA[merger]]></category>
		<category><![CDATA[nec]]></category>
		<category><![CDATA[Panasonic]]></category>
		<category><![CDATA[renesas]]></category>
		<category><![CDATA[Taiwan]]></category>
		<category><![CDATA[Toshiba]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=296</guid>
		<description><![CDATA[For each of the jewels in the technology triple crown of conferences &#8211; IEDM, ISSCC, and VLSI &#8211; I hope to preview (and occasionally post-analyze) the papers. But what started as a quick look at the 2009 edition of the VLSI Circuits and Technology Symposia quickly veered into a commentary on the Japanese electronics industry.
This [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/05/20/vlsi-japan/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Nintendo DSi</title>
		<link>http://www.semiconductorblog.com/2009/05/08/nintendo-dsi/</link>
		<comments>http://www.semiconductorblog.com/2009/05/08/nintendo-dsi/#comments</comments>
		<pubDate>Fri, 08 May 2009 17:15:44 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Game consoles]]></category>
		<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=286</guid>
		<description><![CDATA[I have to say I like the Nintendo DS. The popular gaming platform is a clever mix of form, function and fashion not to mention my initials. I wonder if Nintendo was thinking of me...Getting back to reality for a second (at least my version), the DS is worthy of more than my monogram...certainly the 100M unit sales mark that it recently surpassed. Although it was released last year in Japan, Nintendo appeared to time its launch of an upgraded version of the DS in North America dubbed DSi to coincide with the 100M sales mark.]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/05/08/nintendo-dsi/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Weak Node</title>
		<link>http://www.semiconductorblog.com/2009/04/28/weak-node/</link>
		<comments>http://www.semiconductorblog.com/2009/04/28/weak-node/#comments</comments>
		<pubDate>Tue, 28 Apr 2009 20:40:04 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[ITRS]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>
		<category><![CDATA[28nm]]></category>
		<category><![CDATA[32nm]]></category>
		<category><![CDATA[40nm]]></category>
		<category><![CDATA[45nm]]></category>
		<category><![CDATA[ibm]]></category>
		<category><![CDATA[intel]]></category>
		<category><![CDATA[tsmc]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=282</guid>
		<description><![CDATA[As I mentioned last week, there&#8217;s a lot of discussion about half nodes and &#8220;weak&#8221; nodes for logic technology. There&#8217;s no disputing that the semiconductor business ebbs and flows in predictable cycles, so there are points in time where the business climate may just not support gearing up for high volume production. If a downturn [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/04/28/weak-node/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>2009 Insight Award Winners</title>
		<link>http://www.semiconductorblog.com/2009/04/13/insight-award-winners/</link>
		<comments>http://www.semiconductorblog.com/2009/04/13/insight-award-winners/#comments</comments>
		<pubDate>Mon, 13 Apr 2009 17:18:36 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Semiconductor Insights]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=261</guid>
		<description><![CDATA[In the TechInsights tradition, every attempt is made to inspire those designers, engineers and builders who actually do the work of creating technology. To highlight this, a special awards ceremony was held recently in San Francisco. As many of you know, Semiconductor Insights has offered leading technology companies a chance to showcase their best efforts [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/04/13/insight-award-winners/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>TSMC&#8217;s Intel ARM</title>
		<link>http://www.semiconductorblog.com/2009/03/05/tsmcs-intel-arm/</link>
		<comments>http://www.semiconductorblog.com/2009/03/05/tsmcs-intel-arm/#comments</comments>
		<pubDate>Fri, 06 Mar 2009 02:09:58 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[embedded processor]]></category>
		<category><![CDATA[intel]]></category>
		<category><![CDATA[tsmc]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/?p=251</guid>
		<description><![CDATA[Here are some ramblings to follow up my February 10 post regarding Intel going after some of the ARM processor core market.
The Intel-TSMC announcement this week has set the media a-buzz with what the new collaboration could mean. Perhaps the case for Intel (or anyone with a viable processor design for that matter) going after [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2009/03/05/tsmcs-intel-arm/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>IEDM 2008 Preview</title>
		<link>http://www.semiconductorblog.com/2008/12/11/iedm-2008-preview/</link>
		<comments>http://www.semiconductorblog.com/2008/12/11/iedm-2008-preview/#comments</comments>
		<pubDate>Fri, 12 Dec 2008 03:58:56 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/12/11/iedm-2008-preview/</guid>
		<description><![CDATA[Leaving things until the last minute is certainly nothing new for me, but I might be better off waiting to summarize next week&#8217;s IEDM than trying to preview it here. These days, there is a constant flow of negative news in the chip industry and the wider economy, so thinking about the research and development [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/12/11/iedm-2008-preview/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Oil and Sun</title>
		<link>http://www.semiconductorblog.com/2008/11/10/oil-and-sun/</link>
		<comments>http://www.semiconductorblog.com/2008/11/10/oil-and-sun/#comments</comments>
		<pubDate>Mon, 10 Nov 2008 14:50:02 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Solar Energy]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/11/10/oil-and-sun/</guid>
		<description><![CDATA[I&#8217;m not suggesting any cause and effect, but three weeks after trading in my gas guzzling minivan for an economy car rated at 6.2 litres per 100km, gas prices here in Ottawa are set to dip below $0.80 per litre. (Actually, it&#8217;s taken a week to get around to finishing this post, and I actually [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/11/10/oil-and-sun/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Flash Forward to Toshiba&#8217;s High-K</title>
		<link>http://www.semiconductorblog.com/2008/10/24/flash-forward-to-toshibas-high-k/</link>
		<comments>http://www.semiconductorblog.com/2008/10/24/flash-forward-to-toshibas-high-k/#comments</comments>
		<pubDate>Fri, 24 Oct 2008 20:23:54 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Memory]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/10/24/flash-forward-to-toshibas-high-k/</guid>
		<description><![CDATA[Toshiba is the first flash manufacturer to incorporate a high-K dielectric in their product. Their innovative inter-poly dielectric has allowed Toshiba to scale their floating gate flash memory to 43nm. The 16Gbit multi-level cell (MLC) device from Toshiba sets the new high watermark for NAND flash bit density at 139Mbits/mm².
Samsung claimed the first implementation of high-K [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/10/24/flash-forward-to-toshibas-high-k/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Enough Already</title>
		<link>http://www.semiconductorblog.com/2008/08/18/enough-already/</link>
		<comments>http://www.semiconductorblog.com/2008/08/18/enough-already/#comments</comments>
		<pubDate>Mon, 18 Aug 2008 21:30:23 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Memory]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/08/18/enough-already/</guid>
		<description><![CDATA[For years the question, “How much is enough?” has been debated regarding NAND flash endurance. How many write cycles do you really need over the lifetime of a camera card or memory stick? How long do you need your portable data to stay intact?
SI’s senior memory analyst, Young Choi, attended the recent Flash Memory Summit [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/08/18/enough-already/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Is This Good News?</title>
		<link>http://www.semiconductorblog.com/2008/08/11/is-this-good-news/</link>
		<comments>http://www.semiconductorblog.com/2008/08/11/is-this-good-news/#comments</comments>
		<pubDate>Mon, 11 Aug 2008 19:28:15 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/08/11/is-this-good-news/</guid>
		<description><![CDATA[David Manners recently reported in Electronics Weekly that the semiconductor materials market will grow at double the rate of the chip industry. The actual numbers quoted from the SIA and SEMI respectively shake out as 4% for semiconductors and 9% for materials. It all sounds like solid growth &#8211; right?
Or does it? I fear that some [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/08/11/is-this-good-news/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Backside Follow-up</title>
		<link>http://www.semiconductorblog.com/2008/06/05/backside-follow-up/</link>
		<comments>http://www.semiconductorblog.com/2008/06/05/backside-follow-up/#comments</comments>
		<pubDate>Thu, 05 Jun 2008 20:07:50 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/06/05/backside-follow-up/</guid>
		<description><![CDATA[Last week, I posted a long, wordy (your own description might not be so flattering) article about OmniVision&#8217;s OmniBSI announcement. To sum up, OmniVision appears to be first out of the gate with a backside illuminated CMOS image sensor for the mass market. Despite the length of last week&#8217;s post, I left out an important [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/06/05/backside-follow-up/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>OmniBSI</title>
		<link>http://www.semiconductorblog.com/2008/05/29/omnibsi/</link>
		<comments>http://www.semiconductorblog.com/2008/05/29/omnibsi/#comments</comments>
		<pubDate>Thu, 29 May 2008 20:00:18 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/05/29/omnibsi/</guid>
		<description><![CDATA[This week presented interesting news as two image sensor technologies I thought might one day displace traditional types appear to have made breakthroughs on the march to commercialization. NHK showcased an active layer over IC &#8211; or AIC -type of sensor while OmniVision announced they would be sampling a backside illuminated - BSI - detector next month. Junko Yoshida&#8217;s detailed article on EETimes put [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/05/29/omnibsi/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>Manufacturing at AMD</title>
		<link>http://www.semiconductorblog.com/2008/05/14/manufacturing-at-amd/</link>
		<comments>http://www.semiconductorblog.com/2008/05/14/manufacturing-at-amd/#comments</comments>
		<pubDate>Wed, 14 May 2008 20:29:49 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/05/14/manufacturing-at-amd/</guid>
		<description><![CDATA[There are more rumors this week about AMD&#8217;s manufacturing strategy. Tony Smith of The Register cited a DigiTimes report that AMD will be adding TSMC as a production partner. Fusion processors are scheduled for late 2009. If you think about it, you could say that AMD already has a long-standing relationship with TSMC. After all, [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/05/14/manufacturing-at-amd/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>AMD Strategy</title>
		<link>http://www.semiconductorblog.com/2008/05/07/amd-strategy/</link>
		<comments>http://www.semiconductorblog.com/2008/05/07/amd-strategy/#comments</comments>
		<pubDate>Thu, 08 May 2008 02:00:24 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/05/07/amd-strategy/</guid>
		<description><![CDATA[From all the rumor and conjecture we hear, AMD&#8217;s manufacturing strategy could well be running out of steam. Could this be another case of milking the local government and low-priced labor in a geography and then pulling up stakes once the subsidies run out or local salaries get too high? There are reports of labor [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/05/07/amd-strategy/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Telepresence</title>
		<link>http://www.semiconductorblog.com/2008/04/24/telepresence/</link>
		<comments>http://www.semiconductorblog.com/2008/04/24/telepresence/#comments</comments>
		<pubDate>Thu, 24 Apr 2008 20:33:38 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/04/24/telepresence/</guid>
		<description><![CDATA[Maybe I missed the point of Web 2.0, or maybe I just don’t have enough bandwidth available at my desktop to make it viable. Either way, it looks like videoconferencing is a technology worth watching.
Our friends at iSuppli recently announced that video conferencing was set to emerge as a major application. Their forecast suggests sales [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/04/24/telepresence/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Heroes and Icons: Gibson versus Guitar Hero</title>
		<link>http://www.semiconductorblog.com/2008/04/03/heroes-and-icons-gibson-versus-guitar-hero/</link>
		<comments>http://www.semiconductorblog.com/2008/04/03/heroes-and-icons-gibson-versus-guitar-hero/#comments</comments>
		<pubDate>Thu, 03 Apr 2008 17:29:46 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Game consoles]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Intellectual Property]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/04/03/heroes-and-icons-gibson-versus-guitar-hero/</guid>
		<description><![CDATA[On March 20, the famous Gibson Guitar Corporation sued Harmonix, MTV, and EA for infringement of US Patent 5,990,405 – System and Method for generating and controlling a Simulated Musical Concert Experience. The defendants named are meant to cover the entire Guitar Hero series as well as the newer Rock Band game. Gibson has since [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/04/03/heroes-and-icons-gibson-versus-guitar-hero/feed/</wfw:commentRss>
		<slash:comments>3</slash:comments>
		</item>
		<item>
		<title>Speculating</title>
		<link>http://www.semiconductorblog.com/2008/03/27/speculating/</link>
		<comments>http://www.semiconductorblog.com/2008/03/27/speculating/#comments</comments>
		<pubDate>Thu, 27 Mar 2008 14:50:08 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/03/27/speculating/</guid>
		<description><![CDATA[Yesterday, the first departure from the post-Micron imaging company Aptina was announced. Dr. Ilia Ovsiannikov has moved to MagnaChip Semiconductor. As Image Sensor reported in detail, Ovsiannikov leaves the senior post at Micron of R&#038;D manager and architect in Imaging to head up North American R&#038;D for MagnaChip at their new design center in Pasadena.
Image [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/03/27/speculating/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Lon-Dan Calling</title>
		<link>http://www.semiconductorblog.com/2008/03/20/lon-dan-calling/</link>
		<comments>http://www.semiconductorblog.com/2008/03/20/lon-dan-calling/#comments</comments>
		<pubDate>Thu, 20 Mar 2008 21:01:37 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Semiconductor Insights]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/03/20/lon-dan-calling/</guid>
		<description><![CDATA[I am in London this week and just wrapped things up at the Intertech-Pira Image Sensor Conference. It was an interesting event with a diverse programme. There was everything from cameraphones to disposable endoscopes to swarms of robotic surveillance insects. Wait. The bugs were just my own nutty comment lifted from IEEE Spectrum. After a [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/03/20/lon-dan-calling/feed/</wfw:commentRss>
		<slash:comments>4</slash:comments>
		</item>
		<item>
		<title>Aptina for sale?</title>
		<link>http://www.semiconductorblog.com/2008/03/07/aptina-for-sale/</link>
		<comments>http://www.semiconductorblog.com/2008/03/07/aptina-for-sale/#comments</comments>
		<pubDate>Fri, 07 Mar 2008 16:40:54 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/03/07/aptina-for-sale/</guid>
		<description><![CDATA[I would hardly be the first to speculate that creating a separate image sensor division with its own brand is part of a larger plan by Micron management to dump the unit now known as Aptina.
According to a quote from Bob Gove in EETimes, Aptina is targeting Japan and their 9 megapixel sensor is already [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/03/07/aptina-for-sale/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>45nm:  What Intel Didn&#8217;t Tell You</title>
		<link>http://www.semiconductorblog.com/2008/01/23/45nm-what-intel-didnt-tell-you/</link>
		<comments>http://www.semiconductorblog.com/2008/01/23/45nm-what-intel-didnt-tell-you/#comments</comments>
		<pubDate>Wed, 23 Jan 2008 19:28:11 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/01/23/45nm-what-intel-didnt-tell-you/</guid>
		<description><![CDATA[This article originally appeared in EETimes Under the Hood. Unfortunately, there was an editing hiccup, so I have decided to post the complete text of the original article here. -Ed 
Two months after Semiconductor Insights provided the first public view of Intel&#8217;s 45nm technology and nearly a month after Intel&#8217;s IEDM presentation, it seems appropriate to revisit [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/01/23/45nm-what-intel-didnt-tell-you/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>ITRS Pre-release</title>
		<link>http://www.semiconductorblog.com/2008/01/22/itrs-pre-release/</link>
		<comments>http://www.semiconductorblog.com/2008/01/22/itrs-pre-release/#comments</comments>
		<pubDate>Tue, 22 Jan 2008 21:17:23 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[ITRS]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2008/01/22/itrs-pre-release/</guid>
		<description><![CDATA[Today Laura Peters from Semiconductor International (the other SI) hosted a webcast providing an overview of the contents of the upcoming 2007 Edition of the Semiconductor Industry Association&#8217;s (SIA) roadmap for technology &#8211; the ITRS. If there is anyone who really knows what&#8217;s in that upcoming document, it is Intel&#8217;s Alan Allan, and he gave [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2008/01/22/itrs-pre-release/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Intel DFV</title>
		<link>http://www.semiconductorblog.com/2007/12/06/intel-dfv/</link>
		<comments>http://www.semiconductorblog.com/2007/12/06/intel-dfv/#comments</comments>
		<pubDate>Thu, 06 Dec 2007 22:46:52 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/12/06/intel-dfv/</guid>
		<description><![CDATA[

 
At the Common Platform Technology Forum last month, the design for manufacturing (DFM) session message was, “not if but when the industry will have to move to structured gate layouts.” Intel already has.
The industry is at a point where design for variability (DFV) is required. The old approach would be to add margin, but design [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/12/06/intel-dfv/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Spray-on IC</title>
		<link>http://www.semiconductorblog.com/2007/11/29/spray-on-ic/</link>
		<comments>http://www.semiconductorblog.com/2007/11/29/spray-on-ic/#comments</comments>
		<pubDate>Thu, 29 Nov 2007 17:42:44 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/11/29/spray-on-ic/</guid>
		<description><![CDATA[MIT Technology Review ran a very interesting story about printable electronics this week. Kovio, a company spun out of MIT&#8217;s Media Lab, announced a new process for printing transistors with inkjet printing techniques. According to this report, Kovio may begin production with disposable smart cards for public transit. Performance of Kovio devices will be better [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/11/29/spray-on-ic/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>R-E-S-P-E-C-T</title>
		<link>http://www.semiconductorblog.com/2007/11/22/r-e-s-p-e-c-t/</link>
		<comments>http://www.semiconductorblog.com/2007/11/22/r-e-s-p-e-c-t/#comments</comments>
		<pubDate>Thu, 22 Nov 2007 17:00:16 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[ITRS]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/11/22/r-e-s-p-e-c-t/</guid>
		<description><![CDATA[Last week, I mentioned that Matsushita might not be getting the respect they deserved with a 45nm process obliterated by Intel&#8217;s shadow. I also should acknowledge that I was one of the doubters and expected Intel to not only get to 45nm first but with a considerable lead on second place. Well it turns out that the speculation by [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/11/22/r-e-s-p-e-c-t/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Penryn Premiere</title>
		<link>http://www.semiconductorblog.com/2007/11/13/penryn-premiere/</link>
		<comments>http://www.semiconductorblog.com/2007/11/13/penryn-premiere/#comments</comments>
		<pubDate>Tue, 13 Nov 2007 18:54:44 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>
		<category><![CDATA[Uncategorized]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/11/13/penryn-premiere/</guid>
		<description><![CDATA[Yesterday marked the dawn of a new era of scaling for CMOS devices. I hope that statement fits with all the hype around the launch of the 45nm microprocessor from Intel. In fairness, though, switching to metal gates and high-k dielectrics represents an important milestone in semiconductor technology. Gordon Moore&#8217;s well-worn comments are appropriate:
&#8220;The implementation [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/11/13/penryn-premiere/feed/</wfw:commentRss>
		<slash:comments>3</slash:comments>
		</item>
		<item>
		<title>Design, Build, Fail and Test</title>
		<link>http://www.semiconductorblog.com/2007/11/07/design-build-fail-and-test/</link>
		<comments>http://www.semiconductorblog.com/2007/11/07/design-build-fail-and-test/#comments</comments>
		<pubDate>Wed, 07 Nov 2007 22:03:16 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Events]]></category>
		<category><![CDATA[ITRS]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/11/07/design-build-fail-and-test/</guid>
		<description><![CDATA[While attending the IBM and associates Common Technology Platform Forum this afternoon, it occured to me that I was bridging the gap between the design community and trying to get it right, and the failure analysis community that steps in too often to mention in polite company. That&#8217;s because I am also in San Jose [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/11/07/design-build-fail-and-test/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>The IFM</title>
		<link>http://www.semiconductorblog.com/2007/11/06/the-ifm/</link>
		<comments>http://www.semiconductorblog.com/2007/11/06/the-ifm/#comments</comments>
		<pubDate>Tue, 06 Nov 2007 21:00:36 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Events]]></category>
		<category><![CDATA[ITRS]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/11/06/the-ifm/</guid>
		<description><![CDATA[The new buzz word &#8211; acronym actually &#8211; coming out of today&#8217;s IBM-Chartered-Samsung Common Platform Forum today here in Santa Clara is the term introduced by Qualcomm Senior VP and GM, Behrooz Abdi. His view of the consortium is to create an &#8220;integrated fabless manufacturer&#8221; or IFM akin to the IDM he means to displace. (Qualcomm [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/11/06/the-ifm/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>45nm: Who will be first?</title>
		<link>http://www.semiconductorblog.com/2007/10/26/45nm-who-will-be-first/</link>
		<comments>http://www.semiconductorblog.com/2007/10/26/45nm-who-will-be-first/#comments</comments>
		<pubDate>Fri, 26 Oct 2007 15:11:06 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/10/26/45nm-who-will-be-first/</guid>
		<description><![CDATA[Well, I certainly believed it would be Intel before Engagdget started trying to change my mind. That site claimed that Panasonic Blu-ray DVD recorders seen at CEATEC contained the UniPhier (Universal Platform for High-quality Image Enhancing Revolution) chip allegedly built with Matsushita&#8217;s 45nm technology. The DVD units are scheduled to roll November 1. Engagdget previously reported [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/10/26/45nm-who-will-be-first/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>Thin is in</title>
		<link>http://www.semiconductorblog.com/2007/10/17/thin-is-in/</link>
		<comments>http://www.semiconductorblog.com/2007/10/17/thin-is-in/#comments</comments>
		<pubDate>Wed, 17 Oct 2007 20:06:58 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/10/17/thin-is-in/</guid>
		<description><![CDATA[Although it has not yet generated as much buzz as the iPhone, the iPod Touch could be the best product designed in Cupertino. The most striking feature of the iPhone was, after all, its touch screen and navigation. More than a few people touted the iPhone as the best iPod ever, and some claimed they [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/10/17/thin-is-in/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>iPhone SiP, PoP, SoC</title>
		<link>http://www.semiconductorblog.com/2007/10/03/iphone-sip-pop-soc/</link>
		<comments>http://www.semiconductorblog.com/2007/10/03/iphone-sip-pop-soc/#comments</comments>
		<pubDate>Wed, 03 Oct 2007 13:48:08 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Packaging]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/10/03/iphone-sip-pop-soc/</guid>
		<description><![CDATA[Confusion abounds about the manufacturer and type of microprocessor found in Apple&#8217;s iPhone. With over a million units shipped to date and Apple on the verge of launching their revolutionary computing platform into Europe, the timing is right to reveal the &#8220;secret.&#8221; Actually, I am just revisiting Semiconductor Insights&#8217; revelation from July as reported in [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/10/03/iphone-sip-pop-soc/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>AMD Four-Banger</title>
		<link>http://www.semiconductorblog.com/2007/09/12/amd-four-banger/</link>
		<comments>http://www.semiconductorblog.com/2007/09/12/amd-four-banger/#comments</comments>
		<pubDate>Wed, 12 Sep 2007 18:23:59 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/09/12/amd-four-banger/</guid>
		<description><![CDATA[AMD added the Quad Core Barcelona to its server lineup of microprocessors this week. Many, including AMD&#8217;s own Hector Ruiz, have said this launch is at least six months late. But AMD is clearly the first to achieve a &#8220;native&#8221; quad core MPU with four processing cores monolithically integrated onto one piece of silicon. Intel&#8217;s [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/09/12/amd-four-banger/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>More Buzz</title>
		<link>http://www.semiconductorblog.com/2007/09/06/more-buzz/</link>
		<comments>http://www.semiconductorblog.com/2007/09/06/more-buzz/#comments</comments>
		<pubDate>Thu, 06 Sep 2007 23:51:09 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>
		<category><![CDATA[Uncategorized]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/09/06/more-buzz/</guid>
		<description><![CDATA[A couple weeks ago I scratched rather shallowly into the topic of turning motion energy into useful electricity (check it out). I was impressed with the development of a technology that could convert power line frequency mechanical vibrations into about 40mW from a device fitting inside a one centimetre cube. This, I argued, would start [...]]]></description>
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		<slash:comments>0</slash:comments>
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		<title>Nanotechnology from Gigatools</title>
		<link>http://www.semiconductorblog.com/2007/07/19/nanotechnology-from-gigatools/</link>
		<comments>http://www.semiconductorblog.com/2007/07/19/nanotechnology-from-gigatools/#comments</comments>
		<pubDate>Thu, 19 Jul 2007 14:25:42 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>
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		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/07/19/nanotechnology-from-gigatools/</guid>
		<description><![CDATA[Since I&#8217;m not at Semicon West this week to talk to any of the industry movers and shakers, I will take certain liberties to comment on a recent EDN interview with Applied Materials CEO, Mike Splinter.
Ed Sperling looked to extract some information about AMAT&#8217;s success in the tool business. Splinter pointed to recognizing and concentrating on [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/07/19/nanotechnology-from-gigatools/feed/</wfw:commentRss>
		<slash:comments>2</slash:comments>
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		<title>Shake It Up, Baby</title>
		<link>http://www.semiconductorblog.com/2007/07/12/shake-it-up-baby/</link>
		<comments>http://www.semiconductorblog.com/2007/07/12/shake-it-up-baby/#comments</comments>
		<pubDate>Thu, 12 Jul 2007 22:24:31 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Uncategorized]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/07/12/shake-it-up-baby/</guid>
		<description><![CDATA[A recent article in Technology Review caught my eye today. A group of engineers at the University of Southampton in England have built a prototype accelerometer powered by ambient vibrations. I&#8217;m happy to see the vibrations that I could never escape and drove me up the wall during my grad student days doing noise measurements [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/07/12/shake-it-up-baby/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
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		<title>iPhone Sends Out S-O-S to the World</title>
		<link>http://www.semiconductorblog.com/2007/07/04/iphone-sends-out-s-o-s-to-the-world/</link>
		<comments>http://www.semiconductorblog.com/2007/07/04/iphone-sends-out-s-o-s-to-the-world/#comments</comments>
		<pubDate>Wed, 04 Jul 2007 21:29:33 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>
		<category><![CDATA[Semiconductor Insights]]></category>
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		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/07/04/iphone-sends-out-s-o-s-to-the-world/</guid>
		<description><![CDATA[If you just crawled out from under a rock or you were too busy filling orders for Saskatchewan sealskin bindings, you may not have heard about Apple&#8217;s iPhone launch last Friday. Fortunately, we did, and our crack marketing team stood in a Boston Apple Store line for 12 hours, raced back to HQ here in Ottawa, and [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/07/04/iphone-sends-out-s-o-s-to-the-world/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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		<title>2007 IEEE International Interconnect Technology Conference</title>
		<link>http://www.semiconductorblog.com/2007/06/19/2007-ieee-international-interconnect-technology-conference/</link>
		<comments>http://www.semiconductorblog.com/2007/06/19/2007-ieee-international-interconnect-technology-conference/#comments</comments>
		<pubDate>Tue, 19 Jun 2007 18:27:26 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>
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		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/06/19/2007-ieee-international-interconnect-technology-conference/</guid>
		<description><![CDATA[A couple of weeks ago, my good friend and semiconductor analysis colleague, Mark Chambers, attended the IITC in San Francisco. The sessions were held from June 4 to 6 at the Hyatt Regency at San Francisco Airport. Because the dates spanned my wedding anniversary and wife&#8217;s birthday and the conference site was far from downtown, [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/06/19/2007-ieee-international-interconnect-technology-conference/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Image Sensors and Lobster &#8211; News from IISW</title>
		<link>http://www.semiconductorblog.com/2007/06/13/image-sensors-and-lobster-news-from-iisw/</link>
		<comments>http://www.semiconductorblog.com/2007/06/13/image-sensors-and-lobster-news-from-iisw/#comments</comments>
		<pubDate>Wed, 13 Jun 2007 19:29:32 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Event Coverage]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Uncategorized]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/06/13/image-sensors-and-lobster-news-from-iisw/</guid>
		<description><![CDATA[Easier than choosing a wine for shellfish was my decision to attend the 2007 International Image Sensor Workshop held last week in beautiful (literally &#8211; see the translation) Ogunquit, Maine. The huge lobster was served up with an even bigger dose of the latest research in imaging technology. The workshop &#8211; formerly known as CCD [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/06/13/image-sensors-and-lobster-news-from-iisw/feed/</wfw:commentRss>
		<slash:comments>2</slash:comments>
		</item>
		<item>
		<title>iPatent</title>
		<link>http://www.semiconductorblog.com/2007/05/16/ipatent/</link>
		<comments>http://www.semiconductorblog.com/2007/05/16/ipatent/#comments</comments>
		<pubDate>Wed, 16 May 2007 18:41:22 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Uncategorized]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/05/16/ipatent/</guid>
		<description><![CDATA[EETimes announced yesterday an Apple patent application describing a touch screen control system. Fans of Apple products (myself included) are excited by the prospect of a whole new breed of devices that could incorporate a touch screen interface. The iPhone is the only product Apple has announced and shown to have this type of interface. [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/05/16/ipatent/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>VLSI &#8211; DRAM Technology</title>
		<link>http://www.semiconductorblog.com/2007/05/09/vlsi-dram-technology/</link>
		<comments>http://www.semiconductorblog.com/2007/05/09/vlsi-dram-technology/#comments</comments>
		<pubDate>Wed, 09 May 2007 20:14:49 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Memory]]></category>
		<category><![CDATA[Process]]></category>
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		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/05/09/vlsi-dram-technology/</guid>
		<description><![CDATA[With the VLSI Syymposia just a little over a month away, I will wrap up my picks for papers to watch for by looking at DRAM. For the Technology Symposium, Samsung is over-represented with five out of the seven presentations split between two sessions.
Two of Samsung&#8217;s articles will discuss aspects of their FinFET DRAM cell, [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/05/09/vlsi-dram-technology/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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		<item>
		<title>TSMC 45nm ready in September &#8211; what&#8217;s changed?</title>
		<link>http://www.semiconductorblog.com/2007/04/10/tsmc-45nm-ready-in-september-for-what/</link>
		<comments>http://www.semiconductorblog.com/2007/04/10/tsmc-45nm-ready-in-september-for-what/#comments</comments>
		<pubDate>Tue, 10 Apr 2007 19:35:20 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/04/10/tsmc-45nm-ready-in-september-for-what/</guid>
		<description><![CDATA[TSMC recently announced it would put its 45nm technology into production this coming September. For me, this begs the question, &#8220;What&#8217;s changed?&#8221; After all, TSMC was relatively late to the 65nm party. Consider the following:

65nm was generally a shrink of 90nm
45nm will be &#8220;new&#8221;
TSMC followed most of the major IDMs and rival UMC into 65nm production
The [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/04/10/tsmc-45nm-ready-in-september-for-what/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>VLSI 2007</title>
		<link>http://www.semiconductorblog.com/2007/04/02/vlsi-2007/</link>
		<comments>http://www.semiconductorblog.com/2007/04/02/vlsi-2007/#comments</comments>
		<pubDate>Mon, 02 Apr 2007 14:20:59 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[Industry News]]></category>
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		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/04/02/vlsi-2007/</guid>
		<description><![CDATA[Once again last week, the organizers of the VLSI Technology and Circuit Symposia organizers supplied me with this year&#8217;s abstracts and conference summary. As always, there are a lot of great papers with all geographic regions well-represented. For today&#8217;s blog, I will start a series of posts about which papers and technologies to watch for [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/04/02/vlsi-2007/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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		<item>
		<title>Micron: New Superpower?</title>
		<link>http://www.semiconductorblog.com/2007/03/26/micron-new-superpower/</link>
		<comments>http://www.semiconductorblog.com/2007/03/26/micron-new-superpower/#comments</comments>
		<pubDate>Mon, 26 Mar 2007 17:57:10 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Uncategorized]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/03/26/micron-new-superpower/</guid>
		<description><![CDATA[After relatively quietly becoming the dominant force in image sensors in the short span of three years, Micron is beginning to show more signs of becoming an Intel-like force in the industry.
The most obvious example of this was the Patent Power article in the November 2006 IEEE Spectrum. 1790 Analytics conducted the first ever patent survey [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/03/26/micron-new-superpower/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Fusion Memory</title>
		<link>http://www.semiconductorblog.com/2007/03/20/fusion-memory/</link>
		<comments>http://www.semiconductorblog.com/2007/03/20/fusion-memory/#comments</comments>
		<pubDate>Tue, 20 Mar 2007 20:12:59 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>
		<category><![CDATA[Memory]]></category>
		<category><![CDATA[Process]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/03/20/fusion-memory/</guid>
		<description><![CDATA[In one of three plenary talks given at the 2006 International Electron Devices Meeting (IEDM), Dr. Chang-Gyu Hwang, president and CEO of Samsung Electronics&#8217; Semiconductor Business, suggested that we are about to experience the largest semiconductor industry transition ever. Chip Shots and Physorg have more detailed accounts of this talk.
An entertaining Dr. Hwang predicted, “The approaching [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2007/03/20/fusion-memory/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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		<item>
		<title>Spot the Lion</title>
		<link>http://www.semiconductorblog.com/2006/09/06/39/</link>
		<comments>http://www.semiconductorblog.com/2006/09/06/39/#comments</comments>
		<pubDate>Wed, 06 Sep 2006 18:32:03 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2007/02/12/39/</guid>
		<description><![CDATA[For years now, we have been subjected to prediction and speculation about the emergence of mainland China as an economic superpower. Several semi foundries were built there with leading edge 300mm wafer capabilities, and it seemed very much like the Chinese would pull much of the world’s IC production out of other sites in Asia.
China [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2006/09/06/39/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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		<item>
		<title>Copper prices soar</title>
		<link>http://www.semiconductorblog.com/2006/07/25/copper-prices-soar/</link>
		<comments>http://www.semiconductorblog.com/2006/07/25/copper-prices-soar/#comments</comments>
		<pubDate>Tue, 25 Jul 2006 15:48:23 +0000</pubDate>
		<dc:creator>Don Scansen</dc:creator>
				<category><![CDATA[Industry News]]></category>

		<guid isPermaLink="false">http://www.semiconductorblog.com/2006/07/25/copper-prices-soar/</guid>
		<description><![CDATA[So much for copper being a low cost replacement for gold wires. Labor strife in Chile has reduced the supply of copper driving up raw material costs. There seems to be no end to high commodity prices faced by the microelectronics industry. If only there was a way to get Wal-Mart on our side to [...]]]></description>
		<wfw:commentRss>http://www.semiconductorblog.com/2006/07/25/copper-prices-soar/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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